IoSense Spring School

Datum

11.04.2018

Zeit

09:00 - 18:00

Sprache

en

Hauptthema

Informatik

Andere Themen

Informatik, Elektro- u. Informationstechnik, Maschinenwesen, Materialien, Bauing., Architektur, Ausgründung/Transfer

Beschreibung

The Spring School of the JU ECSEL project IoSense demonstrates how to engineer innovative products in sensor-actuator networks. The IoSense project focuses on the availability of top innovative, competitive sensors and sensor systems ”Made in Europe” for ”Internet of Sensor” applications in smart mobility, society, energy, health care and production. Participants are enabled to build platforms and complements for hardware- software ecosystems so that their future applications in the Internet of Sensors become reality. The IoSense Spring School presents newest sensor technologies as well as ways how to create innovations with them, extending the value chain with easy-to-build software for sensor applications. Objectives and Scope The target of the IoSense Spring School is to show how to engineer innovative products. The goal is to enable IoT ecosystems based on hardware/software platforms and complementing applications for flexible and high-performance data aggregation and processing in sensor-actuator networks. Participants are enabled to build platforms and complements for hardware-software ecosystems so that their future applications in the Internet of Sensors become reality. The IoSense spring school presents newest sensor technologies as well as ways to create innovations with them, extending the value chain with easy-to-build software for sensor applications. The future technology of IoSense covers - Innovative sensor and multi-sensor technologies for heterogeneous application areas - Highlighting new approaches for developing sensors using flexible frontend and backend pilot lines - Design of sensor and application components for market needs by involving customers early in the development process - Enabling external parties to build IoT ecosystems with IoSense technology - Closing the gap between chip manufacturers and application developers for transforming existing value chain approaches

Links

• Program and Registration

Letztmalig verändert: 20.02.2018, 20:45:19