Microelectronics at mesoscale : Towards flexible and 3D biomedical devices

Datum

02.04.2026

Zeit

13:30 - 15:30

Sprecher

Daniil Karnaushenko

Zugehörigkeit

Research Center for Materials Architectures and Integration of Nanomembranes (MAIN), TU Chemnitz

Serie

TUD nanoSeminar

Sprache

en

Hauptthema

Materialien

Andere Themen

Materialien

Host

Arezoo Dianat

Beschreibung

Emerging materials and advanced manufacturing strategies are key enablers in the evolution of next-generation microelectronic architectures and sensing devices. In recent years, advanced fabrication techniques have been introduced that support the development of flexible thin-foil systems and self-assembly processes capable of forming complex three-dimensional microstructures. These approaches are based on planar processing of carefully engineered material systems—including organic and inorganic, rigid and soft materials—on conventional wafer substrates. The resulting thin-foil systems are then delaminated in a controlled manner and induced to undergo deterministic shape transformations such as folding, buckling, or rolling. For the first time since the dawn of microelectronics, electronic components can now move beyond traditional two-dimensional fabrication constraints, expanding into the third dimension via scalable, monolithic, wafer-level processes. These ultra-lightweight systems, often in the microgram range and only a few micrometers thick, offer previously unattainable benefits in terms of environmental sustainability and mechanical robustness. When combined with modern electronic fabrication methods, they enable the seamless integration of a wide array of miniature functionalities—including active circuits and specialized sensors such as bio- and magnetic sensors. This development paves the way for a new generation of electronically integrated, miniaturized instruments and sensors, purpose-built for biomedical and environmental applications with high functional density and low ecological footprint.

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Letztmalig verändert: 16.03.2026, 07:39:31