Symposium 3D Integration - Technology, Materials, Reliability
- Date
- Apr 16, 2015
- Time
- 12:00 PM - 6:00 PM
- Language
- en
- Main Topic
- Informatik
- Other Topics
- Informatik
- Host
- Prof. Dr. Ehrenfried Zschech
- Description
- We would like to invite you to attend the Symposium "3D Integration - Technology, Materials, Reliability". This symposium will provide a forum for presenting current research and for discussions on issues related to technology, materials, reliability and characterization for 3D integration, including its applications for novel products. This symposium will bring experts from industry, research institutes and universities together to discuss emerging topics in the field of 3D integration in microelectronics. It will be a forum for networking, to strengthen existing and to establish new contacts. The first part of the Symposium "3D Integration - Technology, Materials, Reliability" will be held together with the Focus Session "3D IC Analysis and Metrology" of the 2015 FCMN.
- Links
Last modified: Mar 2, 2015, 11:35:24 AM
Location
Andere (Hotel Hilton)
Organizer
Fraunhofer-Center Nanoelektronische Technologien Königsbrücker Str.18001099Dresden
- Phone
- +49 (0) 351 / 2607 3001
- Fax
- +49 (0) 351 / 2607 / 3005
- Fraunhofer CNT
- Homepage
- http://www.cnt.fraunhofer.de/
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