High-k Capacitor Devices for system-on-chip and system-in-package

Datum

16.10.2015

Zeit

13:00 - 14:00

Sprecher

Dr. Wenke Weinreich

Zugehörigkeit

Fraunhofer Institute for Photonic Microsystems IPMS / CNT, Dresden

Sprache

en

Hauptthema

Materialien

Andere Themen

Materialien, Physik

Host

Ulrike Steere

Beschreibung

The growing demand on miniaturized system solutions is driving the compression of many functions into small package outline. I order to avoid external circuitry; sophisticated solutions for the integration of passive components are required. The suppression of occurring cross-coupling between different power planes can be achieved by placing decoupling capacitors as close as possible to the circuits. At Fraunhofer IPMS-CNT, various thin film capacitor concepts supporting a broad application range and addressing manifold integration concepts are covered. Precisely, this includes the concept phase, material development, optimization up to customization and the demonstration e.g. for RF-filtering, decoupling and energy buffering as possible applications. The specific features are the use of high-k materials for capacitance increase, temperature stability and high reliability as well as the integration in 3D high-aspect ratio structures for thin film super capacitors. The presentation will give an overview on research activities at Fraunhofer IPMS-CNT for system-on-chip (SoC) applications including interposer technologies as well as for ultra-thin silicon capacitors used as system-in-package (SiP), discrete device, or embedded in Printed Circuit Board (PCB). Addressed topics are material development including interface engineering, capacitance scaling, adaption to operation voltages, and reliability requirements. Thereby, the process in focus is atomic layer deposition (ALD). Additionally, all studies are performed with respect to thermal budget limitations. At the end, technology developments to provide the highest capacitance density at smallest foot size and form factor to be included in smart system packages are presented.

Links

• Seminars at the IFW

Letztmalig verändert: 16.10.2015, 10:03:35