MtPh

High-k Capacitor Devices for system-on-chip and system-in-package

Date
Oct 16, 2015
Time
1:00 PM - 2:00 PM
Speaker
Dr. Wenke Weinreich
Affiliation
Fraunhofer Institute for Photonic Microsystems IPMS / CNT, Dresden
Language
en
Main Topic
Materialien
Other Topics
Materialien, Physik
Host
Ulrike Steere
Description
The growing demand on miniaturized system solutions is driving the compression of many functions into small package outline. I order to avoid external circuitry; sophisticated solutions for the integration of passive components are required. The suppression of occurring cross-coupling between different power planes can be achieved by placing decoupling capacitors as close as possible to the circuits. At Fraunhofer IPMS-CNT, various thin film capacitor concepts supporting a broad application range and addressing manifold integration concepts are covered. Precisely, this includes the concept phase, material development, optimization up to customization and the demonstration e.g. for RF-filtering, decoupling and energy buffering as possible applications. The specific features are the use of high-k materials for capacitance increase, temperature stability and high reliability as well as the integration in 3D high-aspect ratio structures for thin film super capacitors. The presentation will give an overview on research activities at Fraunhofer IPMS-CNT for system-on-chip (SoC) applications including interposer technologies as well as for ultra-thin silicon capacitors used as system-in-package (SiP), discrete device, or embedded in Printed Circuit Board (PCB). Addressed topics are material development including interface engineering, capacitance scaling, adaption to operation voltages, and reliability requirements. Thereby, the process in focus is atomic layer deposition (ALD). Additionally, all studies are performed with respect to thermal budget limitations. At the end, technology developments to provide the highest capacitance density at smallest foot size and form factor to be included in smart system packages are presented.
Links

Last modified: Oct 16, 2015, 10:03:35 AM

Location

Leibniz Institut für Festkörper- und Werkstoffforschung Dresden (D2E.27, IFW Dresden)Helmholtzstraße2001069Dresden
Homepage
http://www.ifw-dresden.de

Organizer

Leibniz Institut für Festkörper- und Werkstoffforschung DresdenHelmholtzstraße2001069Dresden
Homepage
http://www.ifw-dresden.de
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